Inductively Coupled Plasma Chemical Vapor Deposition for Silicon-Based Technology Compatible with Low-Temperature (≤220 °C) Flexible Substrates

Yang, K.

physica status solidi (a) applications and materials science 2020 pp. 0-0

185

yang2020inductivelyphysica

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ID: 92117

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92117

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10.1002/pssa.201900556

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