Electrical and thermal analysis for system-in-a package (SiP) implementation platform

Electrical and thermal analysis for system-in-a package (SiP) implementation platform

Wang, M.;Suzuki, K.;Dai, W.;
fourth international symposium on quality electronic design, 2003 proceedings 2015
130
wang2015electricalfourth

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89458
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10.1109/isqed.2003.1194736
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