Modern microelectronic systems and their components are essentially 3D devices that have become smaller and lighter in order to improve performance and reduce costs. To maintain this trend, novel materials and technologies are required that provide more structural freedom in 3D over conventional microelectronics, as well as easier parallel fabrication routes while maintaining compatability with existing manufacturing methods. Self-assembly of initially planar membranes into complex 3D architectures offers a wealth of opportunities to accommodate thin-film microelectronic functionalities in devices and systems possessing improved performance and higher integration density. Existing work in this field, with a focus on components constructed from 3D self-assembly, is reviewed, and an outlook on their application potential in tomorrow's microelectronics world is provided.