Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints
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54192
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0x95644003c57E6F55A65596E3D9Eac6813e3566dA
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54192
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10.1016/j.jallcom.2019.07.184
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Scimatic Chain (ID: 481)
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