Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology
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Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology

Miao, M.
proceedings - electronic components and technology conference 2017 pp. 1880-1887
252
miao2017dataproceedings

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DOI:
10.1109/ECTC.2017.85

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ID: 28803
Ref Key: miao2017dataproceedings
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