Thermal resistance inside an interface crack in the functionally graded sandwich structures

Y‐T Zhou,T‐W Kim; Y‐T Zhou; T‐W Kim

Thermal resistance inside an interface crack in the functionally graded sandwich structures

Y‐T Zhou,T‐W Kim;Y‐T Zhou;T‐W Kim;

fatigue & fracture of engineering materials & structures 2016 Vol. 39 pp. 1067-1080

117

kim2016fatiguethermal

Keywords

thermal resistance interface crack graded sandwich structures higher asymptotic terms thermal stress intensity factors

Access

DOI:

10.1111/ffe.12403

URL:

https://sciprofiles.com/publication/view/e8b16dff0...

Citation

ID: 267076

Ref Key: kim2016fatiguethermal

Use this key to autocite in SciMatic or Thesis Manager

References

No Bibliography

Blockchain Verification

Account:

NFT Contract Address:

0x95644003c57E6F55A65596E3D9Eac6813e3566dA

Article ID:

267076

Unique Identifier:

10.1111/ffe.12403

Network:

Scimatic Chain (ID: 481)

Blockchain Readiness Checklist

Authors

Abstract

Journal Name

Year

Title

4/5

Blockchain Upload Locked

Complete all 5 checklist items to tokenize your article

Gas fees required in SCI Coins

Buy SCI

Saymatik Web3.0 Wallet

Google Play

App Store

Thermal resistance inside an interface crack in the functionally graded sandwich structures

Keywords

Access

Citation

References

References

Blockchain Verification

Blockchain Readiness Checklist

Saymatik Web3.0 Wallet

About

Services

Legal

License