Strengthening of copper matrix by dispersion of metallic oxides particles as an efficient way to increase strength without losing thermal and electrical conductivities has been recognized for many years. Such a composite can withstand high temperatures and keep its properties. Such copper alloys have many applications especially in high temperature including resistance welding electrodes, electrical motors and switches. In the present work, at first, the Cu-1%Al solid solution was prepared by the mechanical alloying process via 48 hours of milling. Subsequently, 0.66 gr of copper oxide was added to Cu-1%Al solid solution and mechanically milled for different milling times of 0,16, 32, 48 hours. The milled powder mixtures were investigated by X-Ray Diffraction and scanning electron microscopy techniques. The lattice parameter of Cu increased at first, but then decreased at longer milling times. The internal strain increased and the average Cu crystal size decreased during milling process.The particle size decreased during the whole process. With increasing annealing temprature from 450°C to 750°C, the microhardness values of samples decreased at the beginning but then increased. From these results, it can be concluded that nanosize aluminaparticles are formed in the copper matrix.