Reliability Enhancement of a Power Semiconductor With Optimized Solder Layer Thickness
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Reliability Enhancement of a Power Semiconductor With Optimized Solder Layer Thickness

Elakkiya R,G. Kavithaa,Vahid Samavatian,K. Alhaifi,Alireza Kokabi,Hossein Moayedi;Elakkiya R;G. Kavithaa;Vahid Samavatian;K. Alhaifi;Alireza Kokabi;Hossein Moayedi;
ieee transactions on power electronics 2020 Vol. 35 pp. 6397-6404
199
moayedi2020ieeereliability

Keywords

stresses thermal optimize power semiconductor solder layer thickness

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DOI:
10.1109/tpel.2019.2951815
URL:
https://sciprofiles.com/publication/view/051fbfc8a...

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ID: 111855
Ref Key: moayedi2020ieeereliability
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