Cu is widely used to contact materials because of its excellent electrical conductivity and economical efficiency, but its high temperature strength is slightly insufficient. In this paper, the less layers of graphene oxide were dispersed in deionized water by ultrasonic treatment, then copper acetate aqueous solution was added to the graphene oxide suspension with mixing. Then add NaOH aqueous solution into the blend solution. With graphene as a substratum, Cu (OH)2 precipitations were generated so that a molecular level dispersion can be achieved. The precipitations were isolated by filtering, rinsing and drying, and then, these powders were reduced at 400°C under a hydrogen atmosphere to form the homogeneously dispersed Cu/graphene composite powders. Sinter powders by spark plasma sintered and we obtained Cu contact materials strengthened by graphene. Under the sintering pressure of 250 Mpa, the hardness of Cu/graphene composite was 171.4 HV, which was 4.3 times than that of annealed copper; the electrical conductivity of Cu/graphene only decreased 5% and can still meet the contact demand.