Studying signal collection in the punch-through protection area of a silicon micro-strip sensor using a micro-focused X-ray beam

Studying signal collection in the punch-through protection area of a silicon micro-strip sensor using a micro-focused X-ray beam

L. Poley,R. Bates,I. Bloch,A.J. Blue,V. Fadeyev,L. Meng,L. Rehnisch,M. Stegler,Y. Unno;L. Poley;R. Bates;I. Bloch;A.J. Blue;V. Fadeyev;L. Meng;L. Rehnisch;M. Stegler;Y. Unno;
nuclear instruments and methods in physics research section a: accelerators, spectrometers, detectors and associated equipment 2018 Vol. 924 pp. 116-119
125
unno2018nuclearstudying

Abstract

For the Phase-II Upgrade of the ATLAS detector The ATLAS Collaboration (2008) [1], a new, all-silicon tracker will be constructed in order to cope with the increased track density and radiation level of the High-Luminosity Large Hadron Collider. While silicon strip sensors are designed to minimise the fraction of dead material and maximise the active area of a sensor, concessions must be made to the requirements of operating a sensor in a particle physics detector. Sensor geometry features like the punch-through protection deviate from the standard sensor architecture and thereby affect the charge collection in that area. In order to study the signal collection of n+-p−-p+ silicon strip sensors over their punch-through-protection area, ATLAS silicon strip sensors were scanned with a micro-focused X-ray beam at the Diamond Light Source. Due to the highly focused X-ray beam (2×3μm2) and the short average path length of an electron after interaction with an X-ray photon (≤2μm), local signal collection in different sensor areas can be studied with high resolution. This study presents results of high resolution 2D-scans of the punch-through protection region of ATLAS silicon micro-strip sensors, showing how far the strip signal collection area extends toward the bias ring and how the region is affected by radiation damage.

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272017
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10.1016/j.nima.2018.06.085
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