Copper (Cu) nanowires were successfully coated with nickel (Ni) using a simple, low-temperature, two-stepsolution process. The effect of different types of solvent, e.g. ethylene glycol and water, on the deposition of Ni on Cu was investigated using a scanning electron microscope (SEM), coupled with energy dispersive X-ray spectrometer (EDX). On the other hand, the composition of the nanowires was determined by X-ray diffraction (XRD). Smoother Cu-Ni nanowires were produced using ethylene glycol due to better dispersion of Cu nanowires and more controlled Ni diffusion during coating. This can be attributed to the slower reduction of Ni(II) ions in ethylene glycol, leading to a more controlled deposition on the Cu nanowires. The as prepared Cu-Ni nanowires were confirmed to be face-centered cubic (fcc) Cu and fcc Ni. Neither oxides of Cu nor Ni were present on the nanowires produced.