Simulation Study of Adhesive Material for Sandwich Panel under Edgewise Compression Condition.

Simulation Study of Adhesive Material for Sandwich Panel under Edgewise Compression Condition.

Jiang, Lanxin;Yang, Bing;Xiao, Shoune;Yang, Guangwu;Zhu, Tao;Dong, Dawei;
Materials (Basel, Switzerland) 2020 Vol. 13
179
jiang2020simulationmaterials

Abstract

In order to study the interfacial adhesive material simulation method of a sandwich structure with aluminum alloy panels and a low-density foam core under edgewise compression condition, two finite element models were defined using material model no. 185 (MAT 185) adhesive element and tiebreak contact, respectively, by LS-DYNA. Under the conditions of different loading rates, and element sizes, the effects of peak load, energy absorption, failure mode of adhesive layer and the influence degree of the changing condition on the calculated results were compared between the two models, and then compared with the experiment results and theoretical results. The higher the loading rate was, or the smaller the element size was, the higher the peak load was. The simulation results obtained using MAT 185 were closer to the experimental results under the edgewise compression condition.

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